Communication Chipsets Make International
DebutMalaysia-based chip designer SiRES Labs Sdn Bhd will
launch a fully fledged range of high speed copper and wireless data
transport systems beyond 10Gbps within the first quarter of 2003.
Three families of 11 chipsets for optical, copper and RF are
currently being tested and characterized for fabrication. "We expect
everything to be completed soon and will be rolled out to customers
thereon," said chief executive officer Vyasa Kandasamy.
MSC-status company develops microchips and transceivers for the
communication and networking market. Its core expertise is in creating
high performance, high speed analog and mixed-signal integrated circuit
designs for the optical, copper and wireless (RF) bands.
secured a total of US$1.5 million between December 2001 and April 2002,
enabling the company to speed up development work and establish a
distribution network in Asia. Plans are also underway to spin off a design
company to offer tailor-made high-end analog design services.
spin-off, driven by customer demand for pure design, will handle contract
design and consultation work on high-end analog and mixed-signal projects,
as well as manage and license out the multitude of in-house developed
intellectual property (IP) cores.
Vyasa claimed that SiRES' products provide more
functionality in a single chip and offer better integration. "We are
working with three technology partners - two in the US and a third in
Europe - to design next-generation devices aimed at pushing large amounts
of data at a faster transfer rate," he said.
The company plans to
sign on local wafer foundry Silterra Sdn Bhd as a partner and is
evaluating another prospect in the US. Currently it has one foundry
partner, Taiwan Semiconductor Manufacturing Co, Ltd (TSMC), of
According to chief technology officer K Saravana Kumar, the
company's objective is to push the limits of CMOS technology to provide
high quality solutions at an attractive cost to customers.
(February 2003 Issue, Nikkei Electronics
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